Inventor
NAKAJIMA DAI
JP38 patents
⚠️ This page may combine multiple inventors who share the name “NAKAJIMA DAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
25 patentsUS6762937B2Jul 13, 2004
Power module
MITSUBISHI ELECTRIC CORP41 citations95
US6501172B1Dec 31, 2002
Power module
MITSUBISHI ELECTRIC CORP48 citations95
US7081671B2Jul 25, 2006
Power module
MITSUBISHI ELECTRIC CORP23 citations92
US6940164B1Sep 6, 2005
Power module
MITSUBISHI ELECTRIC CORP20 citations92
US6903457B2Jun 7, 2005
Power semiconductor device
MITSUBISHI ELECTRIC CORP27 citations92
US6522544B1Feb 18, 2003
Power module
MITSUBISHI ELECTRIC CORP31 citations92
US6304448B1Oct 16, 2001
Power module
MITSUBISHI ELECTRIC CORP50 citations92
US6979843B2Dec 27, 2005
Power semiconductor device
MITSUBISHI ELECTRIC CORP39 citations91
US6867484B2Mar 15, 2005
Semiconductor device
MITSUBISHI ELECTRIC CORP39 citations91
US6787893B2Sep 7, 2004
Semiconductor device
MITSUBISHI ELECTRIC CORP19 citations91
US6700194B2Mar 2, 2004
Semiconductor device
MITSUBISHI ELECTRIC CORP35 citations90
US7151661B2Dec 19, 2006
Capacitor module and semiconductor device using the same
MITSUBISHI ELECTRIC CORP13 citations83
US7151311B2Dec 19, 2006
Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer
MITSUBISHI ELECTRIC CORP19 citations83
US10727167B2Jul 28, 2020
Power semiconductor device and method for manufacturing power semiconductor device
MITSUBISHI ELECTRIC CORP2 citations71
US10529643B2Jan 7, 2020
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP3 citations71
US10461010B2Oct 29, 2019
Power module, power semiconductor device and power module manufacturing method
MITSUBISHI ELECTRIC CORP2 citations71
US9892992B2Feb 13, 2018
Swaged heat sink and heat sink integrated power module
MITSUBISHI ELECTRIC CORP3 citations71
US11152280B2Oct 19, 2021
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP2 citations69
US10768127B2Sep 8, 2020
Thermal conductivity measurement apparatus and thermal conductivity measurement method
MITSUBISHI ELECTRIC CORP3 citations69
US7560809B2Jul 14, 2009
Semiconductor device
MITSUBISHI ELECTRIC CORP4 citations63
US6753596B1Jun 22, 2004
Resin-sealed semiconductor device
MITSUBISHI ELECTRIC CORP3 citations62
US6580147B2Jun 17, 2003
Semiconductor device having built-in capacitors
MITSUBISHI ELECTRIC CORP0 citations51
US11049787B2Jun 29, 2021
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations48
US6984884B2Jan 10, 2006
Electric power semiconductor device
MITSUBISHI ELECTRIC CORP1 citations45
US10775329B2Sep 15, 2020
Thermal conductivity measurement device and thermal conductivity measurement method
MITSUBISHI ELECTRIC CORP0 citations38
SHIRAKATA YUJI
4 patentsUS8299666B2Oct 30, 2012
Control apparatus-integrated dynamoelectric machine
SHIRAKATA YUJI7 citations81
US9698646B2Jul 4, 2017
Rotating electrical machine
SHIRAKATA YUJI2 citations72
US9812929B2Nov 7, 2017
Electric rotating machine
SHIRAKATA YUJI1 citations51
US9531318B2Dec 27, 2016
Rotating electrical machine
SHIRAKATA YUJI0 citations51
FUKASE TATSUYA
4 patentsUS9653969B2May 16, 2017
Brush structure with heat dissipation member
FUKASE TATSUYA2 citations71
US9577495B2Feb 21, 2017
Rotary electric machine
FUKASE TATSUYA3 citations71
US9479029B2Oct 25, 2016
Electric rotating machine
FUKASE TATSUYA4 citations71
US9620444B2Apr 11, 2017
Power semiconductor device
FUKASE TATSUYA0 citations39