Inventor
Tsai Jung-Hsun
TW9 patents
Patents
9 patentsUS9659864B2May 23, 2017
Method and apparatus for forming self-aligned via with selectively deposited etching stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD24 citations94
US9922927B2Mar 20, 2018
Method and apparatus for forming self-aligned via with selectively deposited etching stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9818690B2Nov 14, 2017
Self-aligned interconnection structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10867913B2Dec 15, 2020
Method and apparatus for forming self-aligned via with selectively deposited etching stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11532552B2Dec 20, 2022
Method and apparatus for forming self-aligned via with selectively deposited etching stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11049811B2Jun 29, 2021
Forming interlayer dielectric material by spin-on metal oxide deposition
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10163797B2Dec 25, 2018
Forming interlayer dielectric material by spin-on metal oxide deposition
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10090245B2Oct 2, 2018
Semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9799603B2Oct 24, 2017
Semiconductor device structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52