P

Inventor

WORKMAN THOMAS

US14 patents
⚠️ This page may combine multiple inventors who share the name “WORKMAN THOMAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

9 patents
US11955463B2Apr 9, 2024

Direct bonded stack structures for increased reliability and improved yield in microelectronics

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC6 citations85
US12272677B2Apr 8, 2025

Direct bonded stack structures for increased reliability and improved yield in microelectronics

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC3 citations74
US12191233B2Jan 7, 2025

Embedded cooling systems and methods of manufacturing embedded cooling systems

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC1 citations64
US12550799B2Feb 10, 2026

Direct bonding methods and structures

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC0 citations62
US12532432B2Jan 20, 2026

Hotspot mitigation in fluid cooling

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC0 citations62
US12368087B2Jul 22, 2025

Embedded cooling systems for advanced device packaging and methods of manufacturing the same

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC0 citations62
US12341083B2Jun 24, 2025

Electronic device cooling structures bonded to semiconductor elements

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC0 citations62
US12563749B2Feb 24, 2026

Stacked electronic devices

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC0 citations52
US12080672B2Sep 3, 2024

Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC0 citations52

INTEL CORP

2 patents
US6724078B1Apr 20, 2004

Electronic assembly comprising solderable thermal interface

INTEL CORP46 citations95
US7091063B2Aug 15, 2006

Electronic assembly comprising solderable thermal interface and methods of manufacture

INTEL CORP11 citations83

INVENSAS BONDING TECH INC

1 patent
US11296053B2Apr 5, 2022

Direct bonded stack structures for increased reliability and improved yield in microelectronics

INVENSAS BONDING TECH INC41 citations97

EASTMAN CHEM CO

1 patent
US9387505B2Jul 12, 2016

Methods, materials and apparatus for improving control and efficiency of layer-by-layer processes

EASTMAN CHEM CO9 citations79

ORACLE INT CORP

1 patent
US10417649B2Sep 17, 2019

Business process global searching

ORACLE INT CORP0 citations32