Inventor
HSIANG SHOU-JUI
TW17 patents
⚠️ This page may combine multiple inventors who share the name “HSIANG SHOU-JUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ZHEN DING TECH CO LTD
14 patentsUS10894882B2Jan 19, 2021
Low dielectric resin composition, film and circuit board using the same
ZHEN DING TECH CO LTD2 citations70
US11261328B2Mar 1, 2022
Circuit board using low dielectric resin composition
ZHEN DING TECH CO LTD0 citations60
US11655366B2May 23, 2023
Transparent polyimide mixture, method for manufacturing the transparent polyimide mixture, and method for manufacturing transparent polyimide film
ZHEN DING TECH CO LTD0 citations59
US11680138B2Jun 20, 2023
Polymer dispersion, method for manufacturing the polymer dispersion, and method for manufacturing polymer composite film
ZHEN DING TECH CO LTD0 citations58
US11859038B2Jan 2, 2024
Method for manufacturing a block copolymer of polyamide acid
ZHEN DING TECH CO LTD0 citations47
US11602921B2Mar 14, 2023
Elastic conductive composite fabric capable of detecting and providing electrical signals according to reflections of limbs and body movements
ZHEN DING TECH CO LTD0 citations46
US11524491B2Dec 13, 2022
Method for manufacturing thick polyimide film
ZHEN DING TECH CO LTD0 citations46
US10928730B2Feb 23, 2021
Photosensitive resin composition, and polymer film made therefrom
ZHEN DING TECH CO LTD0 citations46
US10875984B2Dec 29, 2020
Inorganic shell, resin composition, and method for making inorganic shell
ZHEN DING TECH CO LTD0 citations46
US10822522B2Nov 3, 2020
Modified polyimide compound, resin composition and polyimide film
ZHEN DING TECH CO LTD0 citations45
US10428238B2Oct 1, 2019
Resin composition, polyimide film and method for manufacturing polyimide film
ZHEN DING TECH CO LTD0 citations45
US10423069B2Sep 24, 2019
Water soluble photosensitive resin composition and film using same
ZHEN DING TECH CO LTD0 citations45
US10844174B2Nov 24, 2020
Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same
ZHEN DING TECH CO LTD0 citations33
US10329368B2Jun 25, 2019
Photosensitive resin composition, and film and printed circuit board using same
ZHEN DING TECH CO LTD0 citations33