Inventor
KWON HYUK
KR30 patents
⚠️ This page may combine multiple inventors who share the name “KWON HYUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LG ELECTRONICS INC
13 patentsUS10670329B2Jun 2, 2020
Refrigerator
LG ELECTRONICS INC11 citations93
US10808994B2Oct 20, 2020
Refrigerator having a cabinet door with a transparent display
LG ELECTRONICS INC14 citations84
US10767917B2Sep 8, 2020
Refrigerator
LG ELECTRONICS INC5 citations84
US11846464B2Dec 19, 2023
Refrigerator
LG ELECTRONICS INC3 citations73
US11614268B2Mar 28, 2023
Refrigerator
LG ELECTRONICS INC1 citations73
US10619909B2Apr 14, 2020
Refrigerator
LG ELECTRONICS INC3 citations73
US11248836B2Feb 15, 2022
Refrigerator
LG ELECTRONICS INC1 citations72
US11015864B2May 25, 2021
Refrigerator
LG ELECTRONICS INC1 citations72
US12398944B2Aug 26, 2025
Refrigerator
LG ELECTRONICS INC0 citations62
US12305909B2May 20, 2025
Refrigerator
LG ELECTRONICS INC0 citations62
US12215918B2Feb 4, 2025
Refrigerator
LG ELECTRONICS INC0 citations62
US12203698B2Jan 21, 2025
Refrigerator
LG ELECTRONICS INC0 citations62
US11448458B2Sep 20, 2022
Refrigerator
LG ELECTRONICS INC0 citations62
SKIA
4 patentsUS10803608B1Oct 13, 2020
Medical procedure using augmented reality
SKIA22 citations90
US10970862B1Apr 6, 2021
Medical procedure using augmented reality
SKIA3 citations69
US11710246B2Jul 25, 2023
Skin 3D model for medical procedure
SKIA0 citations59
US11341662B2May 24, 2022
Medical procedure using augmented reality
SKIA0 citations59
SAMSUNG ELECTRONICS CO LTD
4 patentsUS5959915ASep 28, 1999
Test method of integrated circuit devices by using a dual edge clock technique
SAMSUNG ELECTRONICS CO LTD25 citations89
US6943577B2Sep 13, 2005
Multichip package test
SAMSUNG ELECTRONICS CO LTD6 citations70
US7327154B2Feb 5, 2008
Multichip package test
SAMSUNG ELECTRONICS CO LTD3 citations59
US9285415B2Mar 15, 2016
Built-off test device and test system including the same
SAMSUNG ELECTRONICS CO LTD0 citations44
ILJIN CO LTD
3 patentsKWON HYUK
2 patentsHYNIX SEMICONDUCTOR INC
2 patentsUS7282421B2Oct 16, 2007
Methods for reducing a thickness variation of a nitride layer formed in a shallow trench isolation CMP process and for forming a device isolation film of a semiconductor device
HYNIX SEMICONDUCTOR INC4 citations58
US7879671B2Feb 1, 2011
Method for manufacturing a semiconductor device that is less prone to DC failures brought about by unwanted defects on capacitors therein
HYNIX SEMICONDUCTOR INC0 citations41