Inventor
DENG FELIX
SG5 patents
Patents
5 patentsUS10991617B2Apr 27, 2021
Methods and apparatus for cleaving of semiconductor substrates
APPLIED MATERIALS INC2 citations69
US11610807B2Mar 21, 2023
Methods and apparatus for cleaving of semiconductor substrates
APPLIED MATERIALS INC0 citations59
US11569122B2Jan 31, 2023
Methods and apparatus for cleaving of semiconductor substrates
APPLIED MATERIALS INC0 citations59
US11929260B2Mar 12, 2024
Low warpage curing methodology by inducing curvature
APPLIED MATERIALS INC0 citations56
US12048948B2Jul 30, 2024
Methods for forming microwave tunable composited thin-film dielectric layer
APPLIED MATERIALS INC0 citations50