Inventor

ZHANG RONGWEI

US25 patents

⚠️ This page may combine multiple inventors who share the name “ZHANG RONGWEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHANG RONGWEI

TEXAS INSTRUMENTS INC

Methods and apparatus for a semiconductor device having bi-material die attach layer

Packaged semiconductor device having leadframe features as pressure valves against delamination

Method for preventing die pad delamination

Self-adhesive die

Methods and apparatus for a semiconductor device having bi-material die attach layer

Methods and apparatus for semiconductor device having bi-material die attach layer

Packaged device with additive substrate surface modification

Packaged device with additive substrate surface modification

2-step die attach for reduced pedestal size of laminate component packages

IC package with heat spreader

IC package with heat spreader

Plastic-packaged semiconductor device having wires with polymerized insulating layer

Semiconductor die with stepped side surface

Printed adhesion deposition to mitigate integrated circuit package delamination

Printed adhesion deposition to mitigate integrated circuit delamination

Self-adhesive die

Method for preventing die pad delamination

Packaging a semiconductor device having wires with polymerized insulator skin

Package heat dissipation including a die attach film

Integrated filter optical package

Wafer level derived flip chip package

Packaged IC with solderable sidewalls

UNIV SOOCHOW

Method for realizing high-speed cladding of hollow offset-focus annular laser

Annular hollow offset-focus laser cladding device

ZHANG RONGWEI

Highly conductive electrically conductive adhesives