Inventor
RYAN MICHAEL E
US7 patents
⚠️ This page may combine multiple inventors who share the name “RYAN MICHAEL E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS7292452B2Nov 6, 2007
Reference layer openings
INTEL CORP13 citations79
US12413001B2Sep 9, 2025
Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package
INTEL CORP0 citations61
US7804694B2Sep 28, 2010
Reference layer openings
INTEL CORP2 citations58
US7495929B2Feb 24, 2009
Reference layer openings
INTEL CORP0 citations48