Inventor
AOKI TOYOHIRO
JP46 patents
⚠️ This page may combine multiple inventors who share the name “AOKI TOYOHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
45 patentsUS9859241B1Jan 2, 2018
Method of forming a solder bump structure
IBM20 citations93
US7250311B2Jul 31, 2007
Wirebond crack sensor for low-k die
IBM31 citations92
US10598874B2Mar 24, 2020
Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
IBM6 citations84
US11684988B2Jun 27, 2023
Prevention of dripping of material for material injection
IBM1 citations73
US11298769B2Apr 12, 2022
Prevention of dripping of material for material injection
IBM3 citations73
US11112570B2Sep 7, 2021
Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
IBM1 citations73
US10991685B2Apr 27, 2021
Assembling of chips by stacking with rotation
IBM2 citations73
US10797011B2Oct 6, 2020
Method of forming solder bumps
IBM3 citations73
US10615143B2Apr 7, 2020
Injection molded solder bumping
IBM3 citations73
US10115692B2Oct 30, 2018
Method of forming solder bumps
IBM2 citations73
US10037967B1Jul 31, 2018
Injection molded solder bumping
IBM2 citations73
US10741514B2Aug 11, 2020
Fabrication of solder balls with injection molded solder
IBM2 citations72
US10037958B2Jul 31, 2018
Fabrication of solder balls with injection molded solder
IBM2 citations72
US9837367B1Dec 5, 2017
Fabrication of solder balls with injection molded solder
IBM2 citations72
US9586281B2Mar 7, 2017
Forming a solder joint between metal layers
IBM2 citations72
US9508594B2Nov 29, 2016
Fabricating pillar solder bump
IBM2 citations63
US9299606B2Mar 29, 2016
Fabricating pillar solder bump
IBM2 citations63
US12183708B2Dec 31, 2024
Double resist structure for electrodeposition bonding
IBM0 citations62
US12166008B2Dec 10, 2024
Injection molded solder head with improved sealing performance
IBM0 citations62
US12142603B2Nov 12, 2024
Bonding of bridge to multiple semiconductor chips
IBM0 citations62
US12094825B2Sep 17, 2024
Interconnection between chips by bridge chip
IBM0 citations62
US11969828B2Apr 30, 2024
Prevention of dripping of material for material injection
IBM0 citations62
US11848272B2Dec 19, 2023
Interconnection between chips by bridge chip
IBM0 citations62
US11735575B2Aug 22, 2023
Bonding of bridge to multiple semiconductor chips
IBM1 citations62
US11329018B2May 10, 2022
Forming of bump structure
IBM0 citations62
US11181704B2Nov 23, 2021
Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
IBM0 citations62
US11164845B2Nov 2, 2021
Resist structure for forming bumps
IBM0 citations62
US10930609B2Feb 23, 2021
Method of forming a solder bump structure
IBM0 citations62
US10325839B2Jun 18, 2019
Reduction of stress in via structure
IBM1 citations62
US12456656B2Oct 28, 2025
Multichip interconnect package
IBM0 citations60
US12315775B2May 27, 2025
Underfill vacuum process
IBM0 citations59
US12354983B2Jul 8, 2025
Fine-pitch joining pad structure
IBM0 citations52
US10840202B2Nov 17, 2020
Method of forming solder bumps
IBM0 citations52
US10833035B2Nov 10, 2020
Method of forming solder bumps
IBM0 citations52
US10424510B2Sep 24, 2019
Solder fill into high aspect through holes
IBM0 citations52
US10388566B2Aug 20, 2019
Solder fill into high aspect through holes
IBM0 citations52
US10692829B2Jun 23, 2020
Method of forming a solder bump structure
IBM0 citations51
US10607956B2Mar 31, 2020
Method of forming a solder bump structure
IBM0 citations51
US10566302B2Feb 18, 2020
Fabrication of solder balls with injection molded solder
IBM0 citations51
US10553553B2Feb 4, 2020
Method of forming a solder bump structure
IBM0 citations51
US10252363B2Apr 9, 2019
Forming a solder joint between metal layers
IBM0 citations51
US10103118B2Oct 16, 2018
Fabrication of solder balls with injection molded solder
IBM0 citations51
US10090586B2Oct 2, 2018
Wireless communication device with joined semiconductors
IBM0 citations51
US9780442B2Oct 3, 2017
Wireless communication device with joined semiconductors
IBM0 citations51
US9520375B2Dec 13, 2016
Method of forming a solder bump on a substrate
IBM0 citations38