Inventor
HISADA TAKASHI
JP48 patents
⚠️ This page may combine multiple inventors who share the name “HISADA TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
44 patentsUS9859241B1Jan 2, 2018
Method of forming a solder bump structure
IBM20 citations93
US6864578B2Mar 8, 2005
Internally reinforced bond pads
IBM16 citations89
US10598874B2Mar 24, 2020
Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
IBM6 citations84
US10613282B2Apr 7, 2020
Fluid control structure
IBM8 citations83
US9989713B1Jun 5, 2018
Fluid control structure
IBM8 citations83
US7489519B1Feb 10, 2009
Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA
IBM8 citations77
US11684988B2Jun 27, 2023
Prevention of dripping of material for material injection
IBM1 citations73
US11298769B2Apr 12, 2022
Prevention of dripping of material for material injection
IBM3 citations73
US11112570B2Sep 7, 2021
Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
IBM1 citations73
US10991685B2Apr 27, 2021
Assembling of chips by stacking with rotation
IBM2 citations73
US10797011B2Oct 6, 2020
Method of forming solder bumps
IBM3 citations73
US10615143B2Apr 7, 2020
Injection molded solder bumping
IBM3 citations73
US10115692B2Oct 30, 2018
Method of forming solder bumps
IBM2 citations73
US10037967B1Jul 31, 2018
Injection molded solder bumping
IBM2 citations73
US10741514B2Aug 11, 2020
Fabrication of solder balls with injection molded solder
IBM2 citations72
US10371907B2Aug 6, 2019
Fluid control structure
IBM2 citations72
US10037958B2Jul 31, 2018
Fabrication of solder balls with injection molded solder
IBM2 citations72
US9837367B1Dec 5, 2017
Fabrication of solder balls with injection molded solder
IBM2 citations72
US7273804B2Sep 25, 2007
Internally reinforced bond pads
IBM6 citations71
US12183708B2Dec 31, 2024
Double resist structure for electrodeposition bonding
IBM0 citations62
US12166008B2Dec 10, 2024
Injection molded solder head with improved sealing performance
IBM0 citations62
US12142603B2Nov 12, 2024
Bonding of bridge to multiple semiconductor chips
IBM0 citations62
US12094825B2Sep 17, 2024
Interconnection between chips by bridge chip
IBM0 citations62
US11969828B2Apr 30, 2024
Prevention of dripping of material for material injection
IBM0 citations62
US11908723B2Feb 20, 2024
Silicon handler with laser-release layers
IBM0 citations62
US11848272B2Dec 19, 2023
Interconnection between chips by bridge chip
IBM0 citations62
US11735575B2Aug 22, 2023
Bonding of bridge to multiple semiconductor chips
IBM1 citations62
US11329018B2May 10, 2022
Forming of bump structure
IBM0 citations62
US11181704B2Nov 23, 2021
Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
IBM0 citations62
US11164845B2Nov 2, 2021
Resist structure for forming bumps
IBM0 citations62
US10930609B2Feb 23, 2021
Method of forming a solder bump structure
IBM0 citations62
US10325839B2Jun 18, 2019
Reduction of stress in via structure
IBM1 citations62
US12456656B2Oct 28, 2025
Multichip interconnect package
IBM0 citations60
US7791209B2Sep 7, 2010
Method of underfill air vent for flipchip BGA
IBM6 citations60
US12315775B2May 27, 2025
Underfill vacuum process
IBM0 citations59
US12354983B2Jul 8, 2025
Fine-pitch joining pad structure
IBM0 citations52
US10840202B2Nov 17, 2020
Method of forming solder bumps
IBM0 citations52
US10833035B2Nov 10, 2020
Method of forming solder bumps
IBM0 citations52
US10692829B2Jun 23, 2020
Method of forming a solder bump structure
IBM0 citations51
US10607956B2Mar 31, 2020
Method of forming a solder bump structure
IBM0 citations51
US10566302B2Feb 18, 2020
Fabrication of solder balls with injection molded solder
IBM0 citations51
US10553553B2Feb 4, 2020
Method of forming a solder bump structure
IBM0 citations51
US10103118B2Oct 16, 2018
Fabrication of solder balls with injection molded solder
IBM0 citations51
US12519061B2Jan 6, 2026
Multichip interconnect package fine jet underfill
IBM0 citations48