Inventor
OCASIO JOSE M
US8 patents
Patents
8 patentsUS6467120B1Oct 22, 2002
Wafer cleaning brush profile modification
IBM55 citations94
US6837777B2Jan 4, 2005
Wafer edge cleaning utilizing polish pad material
IBM39 citations91
US6622334B1Sep 23, 2003
Wafer edge cleaning utilizing polish pad material
IBM35 citations91
US6217422B1Apr 17, 2001
Light energy cleaning of polishing pads
IBM49 citations91
US6343974B1Feb 5, 2002
Real-time method for profiling and conditioning chemical-mechanical polishing pads
IBM43 citations88
US6620029B2Sep 16, 2003
Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces
IBM9 citations73
US6227948B1May 8, 2001
Polishing pad reconditioning via polishing pad material as conditioner
IBM13 citations72
US6334230B1Jan 1, 2002
Wafer cleaning apparatus
IBM4 citations58