Inventor
LEHR MATTHIAS UWE
DE4 patents
Patents
4 patentsUS6737748B2May 18, 2004
Stacked via with specially designed landing pad for integrated semiconductor structures
INFINEON TECHNOLOGIES AG19 citations81
US6429503B2Aug 6, 2002
Connection element in an integrated circuit having a layer structure disposed between two conductive structures
INFINEON TECHNOLOGIES AG13 citations71
US6803612B2Oct 12, 2004
Integrated circuit having electrical connecting elements
INFINEON TECHNOLOGIES AG9 citations70
US6559547B1May 6, 2003
Patterning of content areas in multilayer metalization configurations of semiconductor components
INFINEON TECHNOLOGIES AG2 citations54