P

Inventor

KWON YOUNG-SHIN

KR12 patents
⚠️ This page may combine multiple inventors who share the name “KWON YOUNG-SHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

8 patents
US6552423B2Apr 22, 2003

Higher-density memory card

SAMSUNG ELECTRONICS CO LTD219 citations96
US6483038B2Nov 19, 2002

Memory card

SAMSUNG ELECTRONICS CO LTD142 citations96
US8853694B2Oct 7, 2014

Chip on film package including test pads and semiconductor devices including the same

SAMSUNG ELECTRONICS CO LTD20 citations92
USD445797SJul 31, 2001

Memory card

SAMSUNG ELECTRONICS CO LTD19 citations92
US7405760B2Jul 29, 2008

Image pickup device with non-molded DSP chip and manufacturing method

SAMSUNG ELECTRONICS CO LTD15 citations82
US6617700B2Sep 9, 2003

Repairable multi-chip package and high-density memory card having the package

SAMSUNG ELECTRONICS CO LTD10 citations73
US7659936B2Feb 9, 2010

Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD6 citations71
US8054370B2Nov 8, 2011

Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD1 citations50

SONIX INC

2 patents
US11779940B1Oct 10, 2023

Systems, methods and apparatus for dispensing fluid to an object

SONIX INC4 citations71
US12417935B1Sep 16, 2025

Systems, methods and apparatus for dispensing fluid to an object

SONIX INC0 citations59

HAN SANG-UK

1 patent
US9113545B2Aug 18, 2015

Tape wiring substrate and chip-on-film package including the same

HAN SANG-UK15 citations82

YOUN HAN-SHIN

1 patent
US8278154B2Oct 2, 2012

Method of fabricating a semiconductor device package including a heat radiation plate

YOUN HAN-SHIN0 citations33