Inventor
IMAI TOSHINORI
JP30 patents
⚠️ This page may combine multiple inventors who share the name “IMAI TOSHINORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
12 patentsUS6326299B1Dec 4, 2001
Method for manufacturing a semiconductor device
HITACHI LTD88 citations98
US6376345B1Apr 23, 2002
Process for manufacturing semiconductor integrated circuit device
HITACHI LTD46 citations96
US6638854B2Oct 28, 2003
Semiconductor device and method for manufacturing the same
HITACHI LTD25 citations93
US6561875B1May 13, 2003
Apparatus and method for producing substrate with electrical wire thereon
HITACHI LTD20 citations93
US6509273B1Jan 21, 2003
Method for manufacturing a semiconductor device
HITACHI LTD36 citations93
US6458674B1Oct 1, 2002
Process for manufacturing semiconductor integrated circuit device
HITACHI LTD16 citations93
US7582901B2Sep 1, 2009
Semiconductor device comprising metal insulator metal (MIM) capacitor
HITACHI LTD12 citations84
US6531400B2Mar 11, 2003
Process for manufacturing semiconductor integrated circuit device
HITACHI LTD12 citations82
US6495466B2Dec 17, 2002
Method of manufacturing a semiconductor device and a semiconductor device
HITACHI LTD6 citations72
US8048735B2Nov 1, 2011
Manufacturing method of semiconductor device
HITACHI LTD5 citations63
US8040214B2Oct 18, 2011
Semiconductor device and manufacturing method of the same
HITACHI LTD4 citations63
US7981761B2Jul 19, 2011
Method of manufacturing semiconductor device having MIM capacitor
HITACHI LTD6 citations60
RENESAS TECH CORP
11 patentsUS6908847B2Jun 21, 2005
Method of manufacturing a semiconductor device having an interconnect embedded in an insulating film
RENESAS TECH CORP46 citations96
US6818546B2Nov 16, 2004
Semiconductor integrated circuit device and a method of manufacturing the same
RENESAS TECH CORP50 citations96
US7659201B2Feb 9, 2010
Process for manufacturing semiconductor integrated circuit device
RENESAS TECH CORP10 citations93
US6982200B2Jan 3, 2006
Semiconductor device manufacturing method
RENESAS TECH CORP21 citations92
US6696357B2Feb 24, 2004
Method for manufacturing semiconductor integrated circuit devices using a conductive layer to prevent peeling between a bonding pad and an underlying insulating film
RENESAS TECH CORP20 citations92
US7642652B2Jan 5, 2010
Semiconductor integrated circuit device and a method of manufacturing the same
RENESAS TECH CORP9 citations84
US7321171B2Jan 22, 2008
Semiconductor integrated circuit device
RENESAS TECH CORP10 citations84
US7510970B2Mar 31, 2009
Process for manufacturing semiconductor integrated circuit device
RENESAS TECH CORP5 citations74
US6800557B2Oct 5, 2004
Process for manufacturing semiconductor integrated circuit device
RENESAS TECH CORP8 citations74
US6734104B2May 11, 2004
Method of manufacturing a semiconductor device and a semiconductor device
RENESAS TECH CORP7 citations72
US6855035B2Feb 15, 2005
Apparatus and method for producing substrate with electrical wire thereon
RENESAS TECH CORP5 citations63