Inventor
MCCORMICK CAROLYN R
US11 patents
⚠️ This page may combine multiple inventors who share the name “MCCORMICK CAROLYN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS6580174B2Jun 17, 2003
Vented vias for via in pad technology yield improvements
INTEL CORP84 citations96
US6630631B1Oct 7, 2003
Apparatus and method for interconnection between a component and a printed circuit board
INTEL CORP27 citations92
US6509530B2Jan 21, 2003
Via intersect pad for electronic components and methods of manufacture
INTEL CORP24 citations92
US7036217B2May 2, 2006
Methods of manufacturing via intersect pad for electronic components
INTEL CORP14 citations83
US7168164B2Jan 30, 2007
Methods for forming via shielding
INTEL CORP11 citations82
US6927346B2Aug 9, 2005
Surface mount technology to via-in-pad interconnections
INTEL CORP10 citations73
US7271349B2Sep 18, 2007
Via shielding for power/ground layers on printed circuit board
INTEL CORP6 citations61
US7352061B2Apr 1, 2008
Flexible core for enhancement of package interconnect reliability
INTEL CORP4 citations58
US9516752B2Dec 6, 2016
Underfill device and method
INTEL CORP1 citations48
US7633142B2Dec 15, 2009
Flexible core for enhancement of package interconnect reliability
INTEL CORP0 citations48