Inventor

PENG KUO-WEN

TW2 patents

⚠️ This page may combine multiple inventors who share the name “PENG KUO-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

1 patent

US7656029B2Feb 2, 2010

Cut-out heat slug for integrated circuit device packaging

TAIWAN SEMICONDUCTOR MFG1 citations44

CHEN CHIA-CHUN

1 patent

US8222731B2Jul 17, 2012

Cut-out heat slug for integrated circuit device packaging

CHEN CHIA-CHUN0 citations41