Inventor
PARK SOOJAE
KR17 patents
⚠️ This page may combine multiple inventors who share the name “PARK SOOJAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
10 patentsUS9402315B2Jul 26, 2016
Semiconductor package having magnetic connection member
SAMSUNG ELECTRONICS CO LTD7 citations82
US9960107B2May 1, 2018
Package substrate, method for fabricating the same, and package device including the package substrate
SAMSUNG ELECTRONICS CO LTD2 citations72
US9397052B2Jul 19, 2016
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations72
US10147616B2Dec 4, 2018
Package frame and method of manufacturing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD3 citations66
US12451291B2Oct 21, 2025
Capacitor wire and electronic device including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12080479B2Sep 3, 2024
Chip capacitor including capacitor wires
SAMSUNG ELECTRONICS CO LTD1 citations61
US11508681B2Nov 22, 2022
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US12267962B2Apr 1, 2025
Capacitor-wire-embedded wiring board
SAMSUNG ELECTRONICS CO LTD0 citations51
US10777495B2Sep 15, 2020
Printed circuit board and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US10134666B2Nov 20, 2018
Package substrate, method for fabricating the same, and package device including the package substrate
SAMSUNG ELECTRONICS CO LTD1 citations51
IBM
3 patentsUS8352230B2Jan 8, 2013
Integrated framework for finite-element methods for package, device and circuit co-design
IBM5 citations72
US11315803B2Apr 26, 2022
Stress mitigation in organic laminates
IBM0 citations62
US7516674B1Apr 14, 2009
Method and apparatus for thermally induced testing of materials under transient temperature
IBM5 citations62