P

Inventor

SHIGA EISUKE

JP20 patents
⚠️ This page may combine multiple inventors who share the name “SHIGA EISUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI GAS CHEMICAL CO

16 patents
US11195638B2Dec 7, 2021

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

MITSUBISHI GAS CHEMICAL CO2 citations71
US10676579B2Jun 9, 2020

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

MITSUBISHI GAS CHEMICAL CO3 citations71
US10030141B2Jul 24, 2018

Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board

MITSUBISHI GAS CHEMICAL CO2 citations71
US9902851B2Feb 27, 2018

Resin composition, prepreg, laminate, and printed wiring board

MITSUBISHI GAS CHEMICAL CO4 citations71
US11769607B2Sep 26, 2023

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

MITSUBISHI GAS CHEMICAL CO0 citations61
US10703874B2Jul 7, 2020

Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them

MITSUBISHI GAS CHEMICAL CO1 citations59
US10550228B2Feb 4, 2020

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

MITSUBISHI GAS CHEMICAL CO1 citations58
US10178767B2Jan 8, 2019

Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board

MITSUBISHI GAS CHEMICAL CO0 citations51
US10815349B2Oct 27, 2020

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

MITSUBISHI GAS CHEMICAL CO0 citations50
US10717837B2Jul 21, 2020

Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same

MITSUBISHI GAS CHEMICAL CO0 citations49
US10292260B2May 14, 2019

Insulating layer for printed circuit board and printed circuit board

MITSUBISHI GAS CHEMICAL CO0 citations49
US10138393B2Nov 27, 2018

Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board

MITSUBISHI GAS CHEMICAL CO0 citations49
US10721817B2Jul 21, 2020

Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them

MITSUBISHI GAS CHEMICAL CO0 citations40
US10563029B2Feb 18, 2020

Resin composition and prepreg, resin sheet, laminate, and printed circuit board

MITSUBISHI GAS CHEMICAL CO0 citations40
US10869390B2Dec 15, 2020

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

MITSUBISHI GAS CHEMICAL CO0 citations39
US10791626B2Sep 29, 2020

Prepreg, metal foil-clad laminate, and printed wiring board

MITSUBISHI GAS CHEMICAL CO0 citations39

AUDIO TECHNICA KK

4 patents