P

Inventor

KATO YOSHIHIRO

JP81 patents
⚠️ This page may combine multiple inventors who share the name “KATO YOSHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI GAS CHEMICAL CO

12 patents
US6337463B1Jan 8, 2002

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

MITSUBISHI GAS CHEMICAL CO28 citations93
US6736988B1May 18, 2004

Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board

MITSUBISHI GAS CHEMICAL CO31 citations92
US6708404B1Mar 23, 2004

Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole

MITSUBISHI GAS CHEMICAL CO33 citations90
US7601429B2Oct 13, 2009

Prepreg and laminate

MITSUBISHI GAS CHEMICAL CO12 citations83
US6750422B2Jun 15, 2004

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

MITSUBISHI GAS CHEMICAL CO8 citations74
US10518341B2Dec 31, 2019

Cutting method for fiber reinforced composite material

MITSUBISHI GAS CHEMICAL CO3 citations72
US9944787B2Apr 17, 2018

Resin composition, prepreg and laminate

MITSUBISHI GAS CHEMICAL CO4 citations71
US9832870B2Nov 28, 2017

Resin composition, prepreg, metal foil-clad laminate and printed wiring board

MITSUBISHI GAS CHEMICAL CO2 citations71
US9775238B2Sep 26, 2017

Resin composition, and prepreg and laminate using the same

MITSUBISHI GAS CHEMICAL CO5 citations71
US11081367B2Aug 3, 2021

Support and method for producing semiconductor device-mounting substrate using the same

MITSUBISHI GAS CHEMICAL CO0 citations60
US11664240B2May 30, 2023

Method for producing laminate having patterned metal foil, and laminate having patterned metal foil

MITSUBISHI GAS CHEMICAL CO0 citations59
US11217445B2Jan 4, 2022

Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device

MITSUBISHI GAS CHEMICAL CO0 citations59

TOKYO ELECTRON LTD

7 patents

SONY CORP

6 patents

KUBOTA KK

5 patents

HITACHI LTD

4 patents

KATO YOSHIHIRO

4 patents

AISAN IND

3 patents

KUBOTA LTD

2 patents

NIPPON DENSO CO

1 patent

TOSHIBA KK

1 patent

HITACHI CONSTRUCTION MACHINERY

1 patent

DENSO CORP

1 patent

TOKI SANGYO CO LTD

1 patent

NOBUKUNI TAKESHI

1 patent

MIYAHIRA TETSURO

1 patent

Showing the top 50 of 81 patents by PatentIndex Score.