Inventor
HU TIAN
TW9 patents
⚠️ This page may combine multiple inventors who share the name “HU TIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
8 patentsUS11289396B2Mar 29, 2022
Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations93
US12087654B2Sep 10, 2024
Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations85
US11764124B2Sep 19, 2023
Sensing component encapsulated by an encapsulant with a roughness surface having a hollow region
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations85
US11171098B2Nov 9, 2021
Package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US12494405B2Dec 9, 2025
Fabricating a sensing component encapsulated by an encapsulation layer with roughed surface having a hollow region
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12068273B2Aug 20, 2024
Package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11600592B2Mar 7, 2023
Package
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11121299B2Sep 14, 2021
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51