Inventor
YEH YUN-HSIN
TW4 patents
Patents
4 patentsUS9825005B2Nov 21, 2017
Semiconductor package with Pillar-Top-Interconnection (PTI) configuration and its MIS fabricating method
POWERTECH TECHNOLOGY INC7 citations81
US10944165B2Mar 9, 2021
Integrated antenna package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC0 citations59
US10862202B1Dec 8, 2020
Integrated antenna package structure and manufacturing method thereof
POWERTECH TECHNOLOGY INC1 citations59
US10249585B2Apr 2, 2019
Stackable semiconductor package and manufacturing method thereof
POWERTECH TECHNOLOGY INC1 citations59