Inventor

HSU HUNG-HSIN

TW83 patents

⚠️ This page may combine multiple inventors who share the name “HSU HUNG-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSU HUNG-HSIN

POWERTECH TECHNOLOGY INC

Chip package structure with conductive pillar and a manufacturing method thereof

Flip chip device having soldered metal posts by surface mounting

Package structure and manufacturing method thereof

Test method for a redistribution layer

Semiconductor package with Pillar-Top-Interconnection (PTI) configuration and its MIS fabricating method

Package structure having a first connection circuit and manufacturing method thereof

Packaging structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Chip package structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structure including at least one connecting module and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structure and manufacturing method thereof

Manufacturing method of package structure

Package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Integrated antenna package structure and manufacturing method thereof

Manufacturing method of package structure

Manufacturing method and a related stackable chip package

Package process method including disposing a die within a recess of a one-piece material

Package method including forming electrical paths through a mold layer

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Method for filling multi-layer chip-stacked gaps

Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications

Package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Integrated antenna package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Chip package structure using silicon interposer as interconnection bridge

Manufacturing method of chip package structure comprising encapsulant having concave surface

Package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Stacked package structure including a chip disposed on a redistribution layer and a molding layer comprises a recess

Stacked package structure with encapsulation and redistribution layer and fabricating method thereof

Manufacturing method of package-on-package structure

Stacked package including exterior conductive element and a manufacturing method of the same

Universal substrate for a semiconductor device having selectively activated fuses

Integrated antenna package structure and manufacturing method thereof

Integrated antenna package structure and manufacturing method thereof

ASIA IC MIC PROCESS INC

Apparatus for mixing materials which have a high mix proportion/ratio therebetween and preparation production system using the same

Nozzle flow stirring pipe

Liquid withdrawal system

HSU HUNG-HSIN

Metal post chip connecting device and method free to use soldering material

Flip chip package maintaining alignment during soldering