Inventor

LIU XIAO HU

US62 patents

⚠️ This page may combine multiple inventors who share the name “LIU XIAO HU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU XIAO HU

IBM

Heat-shielded low power PCM-based reprogrammable EFUSE device

Reprogrammable fuse structure and method

Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures

Silicon chip carrier with conductive through-vias and method for fabricating same

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

Piezo-driven non-volatile memory cell with hysteretic resistance

Stacked via-stud with improved reliability in copper metallurgy

Advanced crack stop structure

Advanced crack stop structure

Thru-silicon-via structures

Controlling fragmentation of chemically strengthened glass

Multiple orientation nanowires with gate stack stressors

Multiple Orientation Nanowires with Gate Stack Sensors

Reprogrammable fuse structure and method

Strained MOS devices using source/drain epitaxy

Crackstop structures and methods of making same

Crackstop structures and methods of making same

Ultralow dielectric constant layer with controlled biaxial stress

Process for preparing electronics structures using a sacrificial multilayer hardmask scheme

Method of extracting properties of back end of line (BEOL) chip architecture

Heat-shielded low power PCM-based reprogrammable eFUSE device

Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network

Piezoelectronic device with novel force amplification

Controlling fragmentation of chemically strengthened glass

Flexible electronics for wearable healthcare sensors

Semiconductor article having a zig-zag guard ring and method of forming the same

Electronics structures using a sacrificial multi-layer hardmask scheme

Flexible electronics for wearable healthcare sensors

Advanced crack stop structure

Elastic modulus mapping of an integrated circuit chip in a chip/device package

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

Forming ultra-thin chips for flexible electronics applications

Advanced crack stop structure

Advanced crack stop structure

Advanced crack stop structure

Nanofluidic channel fabrication by controlled spontaneous fracturing

Wafer-scale power delivery

Flexible electronics for wearable healthcare sensors

Wafer-scale power delivery

ELMEGREEN BRUCE G

Coupling piezoelectric material generated stresses to devices formed in integrated circuits

Coupling piezoelectric material generated stresses to devices formed in integrated circuits

Piezo-effect transistor device and applications

HOUGHAM GARETH GEOFFREY

Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

Negative coefficient of thermal expansion particles

COONEY III EDWARD C

Structure and method for reducing vertical crack propagation

LANE MICHAEL W

Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures

GLOBALFOUNDRIES INC

Thru-silicon-via structures

GLOBALFOUNDRIES US 2 LLC

Through-vias for wiring layers of semiconductor devices

BURR GEOFFREY W

Reprogrammable fuse structure and method

LAI CHUNG WOH

Dislocation engineering using a scanned laser