Inventor
MEHTA VINEET
US27 patents
⚠️ This page may combine multiple inventors who share the name “MEHTA VINEET”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
14 patentsUS7480129B2Jan 20, 2009
Detachable electrostatic chuck for supporting a substrate in a process chamber
APPLIED MATERIALS INC87 citations97
US7244344B2Jul 17, 2007
Physical vapor deposition plasma reactor with VHF source power applied through the workpiece
APPLIED MATERIALS INC34 citations96
US6837968B2Jan 4, 2005
Lower pedestal shield
APPLIED MATERIALS INC40 citations96
US6726805B2Apr 27, 2004
Pedestal with integral shield
APPLIED MATERIALS INC56 citations96
US6652713B2Nov 25, 2003
Pedestal with integral shield
APPLIED MATERIALS INC47 citations96
US7907384B2Mar 15, 2011
Detachable electrostatic chuck for supporting a substrate in a process chamber
APPLIED MATERIALS INC13 citations92
US7697260B2Apr 13, 2010
Detachable electrostatic chuck
APPLIED MATERIALS INC35 citations92
US7252737B2Aug 7, 2007
Pedestal with integral shield
APPLIED MATERIALS INC22 citations92
US7214619B2May 8, 2007
Method for forming a barrier layer in an integrated circuit in a plasma with source and bias power frequencies applied through the workpiece
APPLIED MATERIALS INC36 citations92
US7399943B2Jul 15, 2008
Apparatus for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece
APPLIED MATERIALS INC9 citations84
US7820020B2Oct 26, 2010
Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas
APPLIED MATERIALS INC4 citations74
US7513971B2Apr 7, 2009
Flat style coil for improved precision etch uniformity
APPLIED MATERIALS INC5 citations63
US7268076B2Sep 11, 2007
Apparatus and method for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece
APPLIED MATERIALS INC6 citations62
US6875927B2Apr 5, 2005
High temperature DC chucking and RF biasing cable with high voltage isolation for biasable electrostatic chuck applications
APPLIED MATERIALS INC4 citations60
BROWN KARL M
3 patentsUS8512526B2Aug 20, 2013
Method of performing physical vapor deposition with RF plasma source power applied to the target using a magnetron
BROWN KARL M7 citations83
US8062484B2Nov 22, 2011
Method for plasma-enhanced physical vapor deposition of copper with RF source power applied to the target
BROWN KARL M7 citations83
US8562798B2Oct 22, 2013
Physical vapor deposition plasma reactor with RF source power applied to the target and having a magnetron
BROWN KARL M4 citations73
GE AVIATION SYSTEMS LLC
3 patentsUS12354486B2Jul 8, 2025
Systems and methods for providing a trajectory planning engine for unmanned aircraft
GE AVIATION SYSTEMS LLC0 citations49
US12211389B2Jan 28, 2025
Apparatus, systems, and method of providing an unmanned and manned air traffic management master services architecture
GE AVIATION SYSTEMS LLC0 citations46
US12033523B2Jul 9, 2024
Apparatus, systems, and methods for providing surveillance services for unmanned aircraft
GE AVIATION SYSTEMS LLC0 citations46
SPOT DEVICES INC
2 patentsUS7688222B2Mar 30, 2010
Methods, systems and devices related to road mounted indicators for providing visual indications to approaching traffic
SPOT DEVICES INC158 citations95
US7859431B2Dec 28, 2010
Methods, systems and devices related to road mounted indicators for providing visual indications to approaching traffic
SPOT DEVICES INC40 citations88