Inventor
LIN CHUN-YING
TW23 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHUN-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPMOS TECHNOLOGIES INC
12 patentsUS7642137B2Jan 5, 2010
Manufacturing method of chip package
CHIPMOS TECHNOLOGIES INC83 citations96
US7932531B2Apr 26, 2011
Chip package
CHIPMOS TECHNOLOGIES INC29 citations91
US7902649B2Mar 8, 2011
Leadframe for leadless package, structure and manufacturing method using the same
CHIPMOS TECHNOLOGIES INC3 citations62
US7851896B2Dec 14, 2010
Quad flat non-leaded chip package
CHIPMOS TECHNOLOGIES INC4 citations62
US7803667B2Sep 28, 2010
Manufacturing process for a quad flat non-leaded chip package structure
CHIPMOS TECHNOLOGIES INC2 citations62
US7803666B2Sep 28, 2010
Manufacturing process for a Quad Flat Non-leaded chip package structure
CHIPMOS TECHNOLOGIES INC2 citations62
US7795079B2Sep 14, 2010
Manufacturing process for a quad flat non-leaded chip package structure
CHIPMOS TECHNOLOGIES INC2 citations62
US7446400B2Nov 4, 2008
Chip package structure and fabricating method thereof
CHIPMOS TECHNOLOGIES INC4 citations61
US7851270B2Dec 14, 2010
Manufacturing process for a chip package structure
CHIPMOS TECHNOLOGIES INC0 citations52
US7851262B2Dec 14, 2010
Manufacturing process for a chip package structure
CHIPMOS TECHNOLOGIES INC0 citations52
US7842550B2Nov 30, 2010
Method of fabricating quad flat non-leaded package
CHIPMOS TECHNOLOGIES INC0 citations48
US7790514B2Sep 7, 2010
Manufacturing process for a chip package structure
CHIPMOS TECHNOLOGIES INC0 citations41
TAIWAN SEMICONDUCTOR MFG CO LTD
2 patentsUS10535593B2Jan 14, 2020
Package structure having a plurality of conductive balls with narrow width for ball waist
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US10276481B2Apr 30, 2019
Package structure having a plurality of conductive balls having narrow width for the ball waist
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70