Inventor
RESHOTKO MIRIAM
US15 patents
Patents
15 patentsUS7700975B2Apr 20, 2010
Schottky barrier metal-germanium contact in metal-germanium-metal photodetectors
INTEL CORP26 citations92
US11444024B2Sep 13, 2022
Subtractively patterned interconnect structures for integrated circuits
INTEL CORP10 citations84
US12027458B2Jul 2, 2024
Subtractively patterned interconnect structures for integrated circuits
INTEL CORP2 citations71
US11264317B2Mar 1, 2022
Antifuse memory arrays with antifuse elements at the back-end-of-line (BEOL)
INTEL CORP2 citations67
US11894270B2Feb 6, 2024
Grating replication using helmets and topographically-selective deposition
INTEL CORP0 citations62
US11843054B2Dec 12, 2023
Vertical architecture of thin film transistors
INTEL CORP1 citations62
US11527656B2Dec 13, 2022
Contact electrodes for vertical thin-film transistors
INTEL CORP1 citations62
US11335598B2May 17, 2022
Grating replication using helmets and topographically-selective deposition
INTEL CORP0 citations62
US7948010B2May 24, 2011
Dual seed semiconductor photodetectors
INTEL CORP4 citations62
US7553687B2Jun 30, 2009
Dual seed semiconductor photodetectors
INTEL CORP4 citations62
US12482744B2Nov 25, 2025
Subtractively patterned interconnect structures for integrated circuits
INTEL CORP0 citations61
US11664305B2May 30, 2023
Staggered lines for interconnect performance improvement and processes for forming such
INTEL CORP0 citations61
US12500162B2Dec 16, 2025
Staggered vertically spaced integrated circuit line metallization with differential vias and metal-selective deposition
INTEL CORP0 citations50
US12598977B2Apr 7, 2026
Fill of vias in single and dual damascene structures using self-assembled monolayer
INTEL CORP0 citations49
US12009433B2Jun 11, 2024
Multi-dielectric gate stack for crystalline thin film transistors
INTEL CORP0 citations49