Inventor

HUNG CHING-WEI

TW2 patents

⚠️ This page may combine multiple inventors who share the name “HUNG CHING-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

POWERTECH TECHNOLOGY INC

1 patent

US7884472B2Feb 8, 2011

Semiconductor package having substrate ID code and its fabricating method

POWERTECH TECHNOLOGY INC13 citations79

HUNG CHING-WEI

1 patent

US8159063B2Apr 17, 2012

Substrate and package with micro BGA configuration

HUNG CHING-WEI2 citations48