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Inventor
CHAN ENG FOOK
MY
2 patents
Patents
2 patents
US10515891B2
Dec 24, 2019
Radial solder ball pattern for attaching semiconductor and micromechanical chips
INTEL CORP
0 citations
40
US10109570B2
Oct 23, 2018
Radial solder ball pattern for attaching semiconductor and micromechanical chips
INTEL CORP
0 citations
40