P

Inventor

OPPERMANN HANS-HERMANN

DE20 patents
⚠️ This page may combine multiple inventors who share the name “OPPERMANN HANS-HERMANN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FRAUNHOFER GES FORSCHUNG

12 patents
US6093971AJul 25, 2000

Chip module with conductor paths on the chip bonding side of a chip carrier

FRAUNHOFER GES FORSCHUNG18 citations84
US5976302ANov 2, 1999

Method of joining electronic components to a substrate

FRAUNHOFER GES FORSCHUNG10 citations69
US10658187B2May 19, 2020

Method for manufacturing a semiconductor component and a semiconductor component

FRAUNHOFER GES FORSCHUNG4 citations66
US5845838ADec 8, 1998

Process for remelting a contact surface metallization

FRAUNHOFER GES FORSCHUNG2 citations59
US11385404B2Jul 12, 2022

Markup system for optical system, carrier substrate, and method for manufacturing of same

FRAUNHOFER GES FORSCHUNG0 citations58
US9507107B2Nov 29, 2016

Arrangement of a substrate with at least one optical waveguide and with an optical coupling location and of an optoelectronic component, and method for manufacturing such an arrangement

FRAUNHOFER GES FORSCHUNG1 citations51
US9134483B2Sep 15, 2015

Optical coupling system having an optical coupler and a light-transmissive external medium and also production and use of such a system

FRAUNHOFER GES FORSCHUNG1 citations51
US7861914B2Jan 4, 2011

Self-assembly of components

FRAUNHOFER GES FORSCHUNG0 citations51
US12519081B2Jan 6, 2026

Method for manufacturing a semiconductor arrangement

FRAUNHOFER GES FORSCHUNG0 citations48
US11726263B2Aug 15, 2023

Optical system, optical components, and method for manufacturing an optical system

FRAUNHOFER GES FORSCHUNG0 citations47
US11402583B2Aug 2, 2022

Assembly comprising a substrate and two components including optical waveguides, as well as method for production

FRAUNHOFER GES FORSCHUNG0 citations40
US9917070B2Mar 13, 2018

Method for arranging electronic switching elements, electronic switching arrangement and use of a carrier having a bonding layer

FRAUNHOFER GES FORSCHUNG0 citations33

PAC TECH GMBH

2 patents

UNIV UTAH RES FOUND

1 patent

ZAKEL ELKE

1 patent

SMART PAC GMBH TECHNOLOGY SERV

1 patent

OPPERMANN HANS-HERMANN

1 patent

SOLZBACHER FLORIAN

1 patent

HUAWEI TECH DUESSELDORF GMBH

1 patent