Inventor
BCHIR OMAR JAMES
US15 patents
⚠️ This page may combine multiple inventors who share the name “BCHIR OMAR JAMES”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
13 patentsUS9379090B1Jun 28, 2016
System, apparatus, and method for split die interconnection
QUALCOMM INC43 citations92
US9642259B2May 2, 2017
Embedded bridge structure in a substrate
QUALCOMM INC18 citations84
US8772951B1Jul 8, 2014
Ultra fine pitch and spacing interconnects for substrate
QUALCOMM INC16 citations84
US9806063B2Oct 31, 2017
Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability
QUALCOMM INC9 citations82
US9679841B2Jun 13, 2017
Substrate and method of forming the same
QUALCOMM INC11 citations82
US9484327B2Nov 1, 2016
Package-on-package structure with reduced height
QUALCOMM INC10 citations80
US9159670B2Oct 13, 2015
Ultra fine pitch and spacing interconnects for substrate
QUALCOMM INC5 citations73
US9601435B2Mar 21, 2017
Semiconductor package with embedded components and method of making the same
QUALCOMM INC2 citations72
US9355898B2May 31, 2016
Package on package (PoP) integrated device comprising a plurality of solder resist layers
QUALCOMM INC2 citations60
US10199152B2Feb 5, 2019
Embedded thin film magnetic carrier for integrated voltage regulator
QUALCOMM INC0 citations51
US9370097B2Jun 14, 2016
Package substrate with testing pads on fine pitch traces
QUALCOMM INC0 citations51
US9609751B2Mar 28, 2017
Package substrate comprising surface interconnect and cavity comprising electroless fill
QUALCOMM INC1 citations50
US12593705B2Mar 31, 2026
Hybrid core substrate with embedded components
QUALCOMM INC0 citations46