Inventor

HAGMANN DIETER

DE4 patents

⚠️ This page may combine multiple inventors who share the name “HAGMANN DIETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

3 patents

US4869781ASep 26, 1989

Method for fabricating a semiconductor integrated circuit structure having a submicrometer length device element

IBM74 citations93

US5268311ADec 7, 1993

Method for forming a thin dielectric layer on a substrate

IBM79 citations91

US5051377ASep 24, 1991

Method for forming a thin dielectric layer on a substrate

IBM10 citations69

EUEN WOLFGANG

1 patent

US5139869AAug 18, 1992

Thin dielectric layer on a substrate

EUEN WOLFGANG3 citations49