Inventor
FARRAR SR PAUL A
US9 patents
Patents
9 patentsUS5478781ADec 26, 1995
Polyimide-insulated cube package of stacked semiconductor device chips
IBM174 citations99
US5270261ADec 14, 1993
Three dimensional multichip package methods of fabrication
IBM332 citations98
US5202754AApr 13, 1993
Three-dimensional multichip packages and methods of fabrication
IBM256 citations98
US5126006AJun 30, 1992
Plural level chip masking
IBM133 citations97
US5194928AMar 16, 1993
Passivation of metal in metal/polyimide structure
IBM99 citations96
US5457345AOct 10, 1995
Metallization composite having nickle intermediate/interface
IBM56 citations94
US5334467AAug 2, 1994
Gray level mask
IBM27 citations92
US5213916AMay 25, 1993
Method of making a gray level mask
IBM45 citations92
US5114754AMay 19, 1992
Passivation of metal in metal/polyimide structures
IBM30 citations92