Inventor
KNOLL ALLAN R
US9 patents
⚠️ This page may combine multiple inventors who share the name “KNOLL ALLAN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
7 patentsUS5372848ADec 13, 1994
Process for creating organic polymeric substrate with copper
IBM74 citations95
US6284329B1Sep 4, 2001
Method of forming adherent metal components on a polyimide substrate
IBM20 citations92
US6194076B1Feb 27, 2001
Method of forming adherent metal components on a polyimide substrate
IBM19 citations92
US5288541AFeb 22, 1994
Method for metallizing through holes in thin film substrates, and resulting devices
IBM26 citations89
US5525369AJun 11, 1996
Method for metallizing through holes in thin film substrates, and resulting devices
IBM16 citations79
US5461203AOct 24, 1995
Electronic package including lower water content polyimide film
IBM10 citations72
US5053104AOct 1, 1991
Method of plasma etching a substrate with a gaseous organohalide compound
IBM6 citations60