Inventor
BIELICK JAMES DANIEL
US2 patents
Patents
2 patentsUS5873512AFeb 23, 1999
Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
IBM42 citations90
US5806753ASep 15, 1998
Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
IBM26 citations90