Inventor
KUAN HSIN
TW7 patents
⚠️ This page may combine multiple inventors who share the name “KUAN HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XINTEC INC
5 patentsUS10714528B2Jul 14, 2020
Chip package and manufacturing method thereof
XINTEC INC1 citations61
US10109663B2Oct 23, 2018
Chip package and method for forming the same
XINTEC INC1 citations51
US9177862B2Nov 3, 2015
Semiconductor stack structure and fabrication method thereof
XINTEC INC0 citations41
US10347616B2Jul 9, 2019
Chip package and manufacturing method thereof
XINTEC INC0 citations40
US9761555B2Sep 12, 2017
Passive component structure and manufacturing method thereof
XINTEC INC0 citations39