P

Inventor

PARK KI-CHUL

KR44 patents
⚠️ This page may combine multiple inventors who share the name “PARK KI-CHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

26 patents
US6861686B2Mar 1, 2005

Structure of a CMOS image sensor and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD103 citations98
US7514354B2Apr 7, 2009

Methods for forming damascene wiring structures having line and plug conductors formed from different materials

SAMSUNG ELECTRONICS CO LTD25 citations92
US7400003B2Jul 15, 2008

Structure of a CMOS image sensor and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD12 citations92
US7335590B2Feb 26, 2008

Method of fabricating semiconductor device by forming diffusion barrier layer selectively and semiconductor device fabricated thereby

SAMSUNG ELECTRONICS CO LTD21 citations92
US7332764B2Feb 19, 2008

Metal-insulator-metal (MIM) capacitor and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD38 citations92
US6884710B2Apr 26, 2005

Semiconductor device having multi-layer copper line and method of forming same

SAMSUNG ELECTRONICS CO LTD21 citations92
US6842028B2Jan 11, 2005

Apparatus for testing reliability of interconnection in integrated circuit

SAMSUNG ELECTRONICS CO LTD21 citations92
US6548905B2Apr 15, 2003

Semiconductor device having multi-layer copper line and method of forming the same

SAMSUNG ELECTRONICS CO LTD30 citations92
US7586175B2Sep 8, 2009

Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface

SAMSUNG ELECTRONICS CO LTD19 citations84
US7205666B2Apr 17, 2007

Interconnections having double capping layer and method for forming the same

SAMSUNG ELECTRONICS CO LTD10 citations84
US6693446B2Feb 17, 2004

Apparatus for testing reliability of interconnection in integrated circuit

SAMSUNG ELECTRONICS CO LTD18 citations83
US7462507B2Dec 9, 2008

Structure of a CMOS image sensor and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD7 citations74
US7605472B2Oct 20, 2009

Interconnections having double capping layer and method for forming the same

SAMSUNG ELECTRONICS CO LTD5 citations73
US10403640B2Sep 3, 2019

Semiconductor devices including insulating capping structures

SAMSUNG ELECTRONICS CO LTD3 citations71
US10397760B2Aug 27, 2019

User terminal device and method for providing web service thereof

SAMSUNG ELECTRONICS CO LTD2 citations71
US7365025B2Apr 29, 2008

Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristics

SAMSUNG ELECTRONICS CO LTD2 citations63
US6690187B2Feb 10, 2004

Apparatus for testing reliability of interconnection in integrated circuit

SAMSUNG ELECTRONICS CO LTD4 citations62
US11341529B2May 24, 2022

Wearable device and method for providing widget thereof

SAMSUNG ELECTRONICS CO LTD1 citations61
US12327759B2Jun 10, 2025

Semiconductor device and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD1 citations60
US12354943B2Jul 8, 2025

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations59
US9667487B2May 30, 2017

Method and apparatus for changing input type in input system using universal plug and play

SAMSUNG ELECTRONICS CO LTD0 citations52
US7951712B2May 31, 2011

Interconnections having double capping layer and method for forming the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US7928002B2Apr 19, 2011

Method of forming wiring layer of semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations51
US11361148B2Jun 14, 2022

Electronic device sharing content with an external device and method for sharing content thereof

SAMSUNG ELECTRONICS CO LTD0 citations50
US11330066B2May 10, 2022

Method for receiving content from external device and electronic device therefor

SAMSUNG ELECTRONICS CO LTD0 citations50
US8697568B2Apr 15, 2014

Semiconductor chip including a plurality of chip areas and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD0 citations49

HYUNDAI MOTOR CO LTD

5 patents

HANWHA CORP

3 patents

LIM BYUNG-SOO

2 patents

KIM JI HYEOK

2 patents

KIA MOTORS CORP

1 patent

SAMSUNG ELECRTONICS CO LTD

1 patent

PARK KI CHUL

1 patent

MAENG JE-YOUNG

1 patent

HWANG TAE-HWAN

1 patent

DTR CO LTD

1 patent