Inventor
PARK KI-CHUL
KR44 patents
⚠️ This page may combine multiple inventors who share the name “PARK KI-CHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
26 patentsUS6861686B2Mar 1, 2005
Structure of a CMOS image sensor and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD103 citations98
US7514354B2Apr 7, 2009
Methods for forming damascene wiring structures having line and plug conductors formed from different materials
SAMSUNG ELECTRONICS CO LTD25 citations92
US7400003B2Jul 15, 2008
Structure of a CMOS image sensor and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD12 citations92
US7335590B2Feb 26, 2008
Method of fabricating semiconductor device by forming diffusion barrier layer selectively and semiconductor device fabricated thereby
SAMSUNG ELECTRONICS CO LTD21 citations92
US7332764B2Feb 19, 2008
Metal-insulator-metal (MIM) capacitor and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD38 citations92
US6884710B2Apr 26, 2005
Semiconductor device having multi-layer copper line and method of forming same
SAMSUNG ELECTRONICS CO LTD21 citations92
US6842028B2Jan 11, 2005
Apparatus for testing reliability of interconnection in integrated circuit
SAMSUNG ELECTRONICS CO LTD21 citations92
US6548905B2Apr 15, 2003
Semiconductor device having multi-layer copper line and method of forming the same
SAMSUNG ELECTRONICS CO LTD30 citations92
US7586175B2Sep 8, 2009
Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface
SAMSUNG ELECTRONICS CO LTD19 citations84
US7205666B2Apr 17, 2007
Interconnections having double capping layer and method for forming the same
SAMSUNG ELECTRONICS CO LTD10 citations84
US6693446B2Feb 17, 2004
Apparatus for testing reliability of interconnection in integrated circuit
SAMSUNG ELECTRONICS CO LTD18 citations83
US7462507B2Dec 9, 2008
Structure of a CMOS image sensor and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD7 citations74
US7605472B2Oct 20, 2009
Interconnections having double capping layer and method for forming the same
SAMSUNG ELECTRONICS CO LTD5 citations73
US10403640B2Sep 3, 2019
Semiconductor devices including insulating capping structures
SAMSUNG ELECTRONICS CO LTD3 citations71
US10397760B2Aug 27, 2019
User terminal device and method for providing web service thereof
SAMSUNG ELECTRONICS CO LTD2 citations71
US7365025B2Apr 29, 2008
Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristics
SAMSUNG ELECTRONICS CO LTD2 citations63
US6690187B2Feb 10, 2004
Apparatus for testing reliability of interconnection in integrated circuit
SAMSUNG ELECTRONICS CO LTD4 citations62
US11341529B2May 24, 2022
Wearable device and method for providing widget thereof
SAMSUNG ELECTRONICS CO LTD1 citations61
US12327759B2Jun 10, 2025
Semiconductor device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations60
US12354943B2Jul 8, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US9667487B2May 30, 2017
Method and apparatus for changing input type in input system using universal plug and play
SAMSUNG ELECTRONICS CO LTD0 citations52
US7951712B2May 31, 2011
Interconnections having double capping layer and method for forming the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7928002B2Apr 19, 2011
Method of forming wiring layer of semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations51
US11361148B2Jun 14, 2022
Electronic device sharing content with an external device and method for sharing content thereof
SAMSUNG ELECTRONICS CO LTD0 citations50
US11330066B2May 10, 2022
Method for receiving content from external device and electronic device therefor
SAMSUNG ELECTRONICS CO LTD0 citations50
US8697568B2Apr 15, 2014
Semiconductor chip including a plurality of chip areas and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD0 citations49
HYUNDAI MOTOR CO LTD
5 patentsUS8875836B2Nov 4, 2014
Tail pipe for muffler of motor vehicle
HYUNDAI MOTOR CO LTD9 citations76
US8905188B2Dec 9, 2014
Muffler for motor vehicle
HYUNDAI MOTOR CO LTD4 citations73
US10208639B2Feb 19, 2019
Structure of muffler
HYUNDAI MOTOR CO LTD4 citations71
US8910471B2Dec 16, 2014
Structure of exhaust pipe for exhaust heat recovery
HYUNDAI MOTOR CO LTD2 citations63
US9371753B2Jun 21, 2016
System of controlling exhaust sound of vehicle automatically and method of the same
HYUNDAI MOTOR CO LTD0 citations42