Inventor
SHIMOMURA JUN
JP15 patents
⚠️ This page may combine multiple inventors who share the name “SHIMOMURA JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON KOGAKU KK
11 patentsUS4055761AOct 25, 1977
Light receiving device for photoelectric conversion element
NIPPON KOGAKU KK110 citations95
US4054890AOct 18, 1977
Exposure control device in a camera using an electro-optic light control element
NIPPON KOGAKU KK44 citations92
US4644148AFeb 17, 1987
Focus detecting apparatus
NIPPON KOGAKU KK17 citations73
US4357086ANov 2, 1982
Focus detecting optical device of a single lens reflex camera
NIPPON KOGAKU KK7 citations73
US4236804ADec 2, 1980
Lens information introducing device having corrected extraneous light
NIPPON KOGAKU KK7 citations73
US4236803ADec 2, 1980
Lens for a camera provided with code patterns
NIPPON KOGAKU KK13 citations73
US4174894ANov 20, 1979
TTL metering device in a single lens reflex camera
NIPPON KOGAKU KK9 citations73
US4034368AJul 5, 1977
Numerical display element
NIPPON KOGAKU KK6 citations73
US4053911AOct 11, 1977
Light-receiving device for use with the exposure meter in single lens reflex camera
NIPPON KOGAKU KK5 citations62
US4088394AMay 9, 1978
Electro-optical light control element
NIPPON KOGAKU KK1 citations51
US4005441AJan 25, 1977
Photometric device of through the lens type exposure meter in a single-lens reflex camera
NIPPON KOGAKU KK1 citations51
YOSHINAGA NAOTO
3 patentsUS8409756B2Apr 2, 2013
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
YOSHINAGA NAOTO1 citations59
US8293860B2Oct 23, 2012
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
YOSHINAGA NAOTO3 citations59
US8158095B2Apr 17, 2012
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
YOSHINAGA NAOTO2 citations59