Inventor
IKEDA TAKAOMI
JP5 patents
Patents
5 patentsUS8411415B2Apr 2, 2013
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
YOSHINAGA NAOTO68 citations93
US8658120B2Feb 25, 2014
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
YOSHINAGA NAOTO3 citations59
US8409756B2Apr 2, 2013
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
YOSHINAGA NAOTO1 citations59
US8293860B2Oct 23, 2012
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
YOSHINAGA NAOTO3 citations59
US8158095B2Apr 17, 2012
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
YOSHINAGA NAOTO2 citations59