Inventor
ANTOKU Yuki
JP10 patents
⚠️ This page may combine multiple inventors who share the name “ANTOKU Yuki”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TANAKA ELECTRONICS IND
9 patentsUS11456271B2Sep 27, 2022
Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same
TANAKA ELECTRONICS IND0 citations58
US11251153B2Feb 15, 2022
Noble metal-coated silver wire for ball bonding, and semiconductor device using noble metal-coated silver wire for ball bonding
TANAKA ELECTRONICS IND1 citations58
US11289442B2Mar 29, 2022
Gold-coated silver bonding wire and manufacturing method thereof, and semiconductor device and manufacturing method thereof
TANAKA ELECTRONICS IND0 citations53
US12087724B2Sep 10, 2024
Palladium-coated copper bonding wire and method for manufacturing same
TANAKA ELECTRONICS IND0 citations51
US12237293B2Feb 25, 2025
Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof
TANAKA ELECTRONICS IND0 citations48
US11876066B2Jan 16, 2024
Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor device
TANAKA ELECTRONICS IND0 citations47
US10195697B2Feb 5, 2019
Palladium (Pd)-coated copper wire for ball bonding
TANAKA ELECTRONICS IND0 citations47
US9972595B2May 15, 2018
Bonding wire for high-speed signal line
TANAKA ELECTRONICS IND1 citations45
US9362249B2Jun 7, 2016
Silver—gold alloy bonding wire
TANAKA ELECTRONICS IND0 citations45