Inventor
MAEDA NANAKO
JP3 patents
Patents
3 patentsUS11996382B2May 28, 2024
Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof
TANAKA ELECTRONICS IND0 citations58
US9972595B2May 15, 2018
Bonding wire for high-speed signal line
TANAKA ELECTRONICS IND1 citations45
US9362249B2Jun 7, 2016
Silver—gold alloy bonding wire
TANAKA ELECTRONICS IND0 citations45