Inventor
JEN WEI-LUN KANE
US14 patents
Patents
14 patentsUS9236366B2Jan 12, 2016
High density organic bridge device and method
INTEL CORP14 citations88
US9548264B2Jan 17, 2017
High density organic bridge device and method
INTEL CORP10 citations83
US12014989B2Jun 18, 2024
Device and method of very high density routing used with embedded multi-die interconnect bridge
INTEL CORP1 citations72
US10672713B2Jun 2, 2020
High density organic bridge device and method
INTEL CORP1 citations72
US10624213B1Apr 14, 2020
Asymmetric electronic substrate and method of manufacture
INTEL CORP5 citations72
US10103105B2Oct 16, 2018
High density organic bridge device and method
INTEL CORP2 citations72
US9603247B2Mar 21, 2017
Electronic package with narrow-factor via including finish layer
INTEL CORP3 citations72
US10978399B2Apr 13, 2021
Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate
INTEL CORP2 citations71
US12002762B2Jun 4, 2024
High density organic bridge device and method
INTEL CORP0 citations62
US10980129B2Apr 13, 2021
Asymmetric electronic substrate and method of manufacture
INTEL CORP0 citations62
US12040276B2Jul 16, 2024
Device and method of very high density routing used with embedded multi-die interconnect bridge
INTEL CORP0 citations61
US11508662B2Nov 22, 2022
Device and method of very high density routing used with embedded multi-die interconnect bridge
INTEL CORP0 citations61
US10916486B2Feb 9, 2021
Semiconductor device including silane based adhesion promoter and method of making
INTEL CORP0 citations59
US9788416B2Oct 10, 2017
Multilayer substrate for semiconductor packaging
INTEL CORP1 citations47