Inventor

SALAMA ISLAM A

US46 patents

⚠️ This page may combine multiple inventors who share the name “SALAMA ISLAM A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SALAMA ISLAM A

INTEL CORP

Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same

Package substrate with high density interconnect design to capture conductive features on embedded die

Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same

Methods of forming sensor integrated packages and structures formed thereby

Method of providing a printed circuit board using laser assisted metallization and patterning of a microelectronic substrate

Microelectronic device with embedded die substrate on interposer

Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same

Device and method of very high density routing used with embedded multi-die interconnect bridge

Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate

Integrated circuit structures with recessed conductive contacts for package on package

Integrated circuit structures with recessed conductive contacts for package on package

Architecture for seamless integrated display system

Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor

Microelectronic device with embedded die substrate on interposer

Microelectronic device with embedded die substrate on interposer

Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same

High density interconnection of microelectronic devices

Method of enabling selective area plating on a substrate

Device and method of very high density routing used with embedded multi-die interconnect bridge

Device and method of very high density routing used with embedded multi-die interconnect bridge

Substrate patch reconstitution options

Architecture for seamless integrated display system

High density interconnection of microelectronic devices

Process for forming a semiconductor device substrate

Device packaging with substrates having embedded lines and metal defined pads

Chip package incorporating interfacial adhesion through conductor sputtering

Device packaging with substrates having embedded lines and metal defined pads

Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate

Systems and methods to laminate passives onto substrate

Systems and methods to laminate passives onto substrate

Systems and methods for semiconductor packages using photoimageable layers

Acousto-optics deflector and mirror for laser beam steering

QUICK NATHANIEL R

Optical device and method of making

Embedded semiconductor component

Optical device and method of making

UNIV CENTRAL FLORIDA

Optical device and method of making

Process for fabricating semiconductor component

ROY MIHIR K

Through mold via polymer block package

Through mold via polymer block package

SALAMA ISLAM A

Laser via drilling apparatus and methods

Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor

ZHANG CHONG

Laser cavity formation for embedded dies or components in substrate build-up layers

LI YONGGANG

Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate

WU TAO

Chip package incorporating interfacial adhesion through conductor sputtering

BOYAPATI SRI RANGA SAI

Package with passivated interconnects

HLAD MARK S

Device packaging with substrates having embedded lines and metal defined pads