Inventor

HIRANO YOSHIKAZU

JP7 patents

⚠️ This page may combine multiple inventors who share the name “HIRANO YOSHIKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJITSU LTD

2 patents

US6482676B2Nov 19, 2002

Method of mounting semiconductor chip part on substrate

FUJITSU LTD35 citations91

US10299387B2May 21, 2019

Substrate on which electronic component is soldered, electronic device, method for soldering electronic component

FUJITSU LTD0 citations49

HIRANO YOSHIKAZU

2 patents

US8338715B2Dec 25, 2012

PCB with soldering pad projections forming fillet solder joints and method of production thereof

HIRANO YOSHIKAZU7 citations78

US8701488B2Apr 22, 2014

Electronic component analyzing apparatus and method

HIRANO YOSHIKAZU0 citations36

FURUSATO NORIAKI

2 patents

US8429984B2Apr 30, 2013

Flow sensor and analysis device provided with same

FURUSATO NORIAKI0 citations42

US8424391B2Apr 23, 2013

Analysis device provided with flow sensor, and flow sensor adjustment method

FURUSATO NORIAKI0 citations31

KYOCERA CORP

1 patent

US11436391B2Sep 6, 2022

Learning method and automatic layout design method

KYOCERA CORP0 citations47