P

Inventor

BOWONDER ANUPAMA

US24 patents
⚠️ This page may combine multiple inventors who share the name “BOWONDER ANUPAMA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

22 patents
US12021149B2Jun 25, 2024

Fin smoothing and integrated circuit structures resulting therefrom

INTEL CORP2 citations73
US11682731B2Jun 20, 2023

Fin smoothing and integrated circuit structures resulting therefrom

INTEL CORP2 citations73
US11462536B2Oct 4, 2022

Integrated circuit structures having asymmetric source and drain structures

INTEL CORP5 citations73
US11430868B2Aug 30, 2022

Buried etch-stop layer to help control transistor source/drain depth

INTEL CORP2 citations73
US11251302B2Feb 15, 2022

Epitaxial oxide plug for strained transistors

INTEL CORP2 citations73
US11735630B2Aug 22, 2023

Integrated circuit structures with source or drain dopant diffusion blocking layers

INTEL CORP2 citations71
US12426299B2Sep 23, 2025

Fin shaping and integrated circuit structures resulting therefrom

INTEL CORP0 citations62
US12237420B2Feb 25, 2025

Fin smoothing and integrated circuit structures resulting therefrom

INTEL CORP0 citations62
US11984449B2May 14, 2024

Channel structures with sub-fin dopant diffusion blocking layers

INTEL CORP0 citations62
US11901457B2Feb 13, 2024

Fin shaping and integrated circuit structures resulting therefrom

INTEL CORP0 citations62
US11757037B2Sep 12, 2023

Epitaxial oxide plug for strained transistors

INTEL CORP0 citations62
US11521968B2Dec 6, 2022

Channel structures with sub-fin dopant diffusion blocking layers

INTEL CORP0 citations62
US11152461B2Oct 19, 2021

Semiconductor layer between source/drain regions and gate spacers

INTEL CORP1 citations62
US12439640B2Oct 7, 2025

Reduced contact resistivity with PMOS germanium and silicon doped with boron gate all around transistors

INTEL CORP0 citations61
US11069795B2Jul 20, 2021

Transistors with channel and sub-channel regions with distinct compositions and dimensions

INTEL CORP1 citations61
US11923412B2Mar 5, 2024

Sub-fin leakage reduction for template strained materials

INTEL CORP0 citations59
US11600696B2Mar 7, 2023

Sub-fin leakage reduction for template strained materials

INTEL CORP0 citations59
US11495683B2Nov 8, 2022

Multiple strain states in epitaxial transistor channel through the incorporation of stress-relief defects within an underlying seed material

INTEL CORP0 citations59
US12484272B2Nov 25, 2025

Source or drain structures with relatively high germanium content

INTEL CORP0 citations52
US11374100B2Jun 28, 2022

Source or drain structures with contact etch stop layer

INTEL CORP0 citations52
US10886272B2Jan 5, 2021

Techniques for forming dual-strain fins for co-integrated n-MOS and p-MOS devices

INTEL CORP0 citations52
US11456357B2Sep 27, 2022

Self-aligned gate edge architecture with alternate channel material

INTEL CORP0 citations48

UNIV CALIFORNIA

1 patent

HU CHENMING

1 patent