Inventor

CETEGEN EDVIN

US31 patents

⚠️ This page may combine multiple inventors who share the name “CETEGEN EDVIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CETEGEN EDVIN

INTEL CORP

Underfill material flow control for reduced die-to-die spacing in semiconductor packages

Mold shelf package design and process flow for advanced package architectures

No mold shelf package design and process flow for advanced package architectures

No mold shelf package design and process flow for advanced package architectures

Conformable heat sink interface with a high thermal conductivity

Thermal interfaces for integrated circuit packages

Protruding SN substrate features for epoxy flow control

Coupled cooling fins in ultra-small systems

Liquid metal TIM with STIM-like performance with no BSM and BGA compatible

Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap

Open cavity bridge co-planar placement architectures and processes

Substrate with thermal insulation

Active package cooling structures using molded substrate packaging technology

Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control

Thermal management solutions for integrated circuit packages

Protruding SN substrate features for epoxy flow control

Dummy die structures of a packaged integrated circuit device

Full package vapor chamber with IHS

Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects

Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap

Corner guard for improved electroplated first level interconnect bump height range

Microelectronic structures including bridges

Multi-package assemblies having foam structures for warpage control

Underfill flow management in electronic assemblies

Thermally-optimized tunable stack in cavity package-on-package

Soldered metallic reservoirs for enhanced transient and steady-state thermal performance

Barrier structures for underfill containment

KARHADE OMKAR G

Methods to form high density through-mold interconnections

CHOUDHURY ARNAB

Thermal management solution for circuit products

KRISHNAN GOPI

Controlling thermal interface material bleed out

TAHOE RES LTD

Underfill material flow control for reduced die-to-die spacing in semiconductor packages