Inventor

HORIUCHI MICHIO

JP97 patents

⚠️ This page may combine multiple inventors who share the name “HORIUCHI MICHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HORIUCHI MICHIO

SHINKO ELECTRIC IND CO

Structure and process for mounting semiconductor chip

Fuel cell

Semiconductor device and process of production of same

Wiring boards, semiconductor devices and their production processes

Semiconductor device having circuit pattern and lands thereon

Wiring substrate having vias

Semiconductor device and method for manufacturing same

Semiconductor device and process for producing the same

Ceramic package

Multi-layered semiconductor device and method for producing the same

Resin sealed stacked semiconductor packages with flat surfaces

Wiring board and semiconductor device

Multilayer circuit board

Power generating apparatus using solid oxide fuel cell

Multilayer wiring board

Multi-layer circuit board

Chip-sized semiconductor device and process for making same

Semiconductor device, connecting substrate therefor, and process of manufacturing connecting substrate

Multi-layer circuit board with particular pad spacing

Multi-layer circuit board

Sintered body for manufacturing ceramic substrate

Ceramic circuit board and semiconductor device using same

Ceramic oxide circuit board

Aluminum nitride circuit board and method of producing same

Aluminum nitride circuit board

Semiconductor device and circuit board used therein

Mullite ceramic compound

Mullite-based ceramic body

Semiconductor device with an exposed external-connection terminal

Anisotropic stress buffer and semiconductor device using the same

Semiconductor device and production thereof

Multilayer wiring substrate, method of manufacturing the same, and semiconductor device

Wiring board and manufacturing method thereof and semiconductor device

Circuit pattern for multi-layer circuit board for mounting electronic parts

Substrate for inspecting electronic device, method of manufacturing substrate, and method of inspecting electronic device

Porous ceramic impregnated wiring body

Fired body for manufacturing a substrate

Ceramic circuit board and manufacturing method thereof

Ceramic oxide circuit board

Wiring substrate with buried substrate having linear conductors

Ultraviolet detection material and ultraviolet detection device

Wiring board having vias

Heat storage device, power generator, and heat generator

Electrode material and fuel cell

Multilayer circuit board

Substrate detaching apparatus

HORIUCHI MICHIO

Joining structure using thermal interface material

Semiconductor device and method of manufacturing semiconductor device

Inductor and manufacturing method thereof

Wiring substrate, its manufacturing method, and semiconductor device