Inventor

KIM CHANGOH

KR70 patents

⚠️ This page may combine multiple inventors who share the name “KIM CHANGOH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM CHANGOH

STATS CHIPPAC PTE LTD

Laser-based redistribution and multi-stacked packages

Laser-based redistribution and multi-stacked packages

Shielded semiconductor packages with open terminals and methods of making via two-step process

Semiconductor device with partial EMI shielding removal using laser ablation

Semiconductor device with partial EMI shielding and method of making the same

EMI shielding for flip chip package with exposed die backside

Shielded semiconductor package with open terminal and methods of making

Semiconductor device and method of forming magnetic field shielding with ferromagnetic material

Semiconductor device and method of forming a slot in EMI shielding layer using a plurality of slot lines to guide a laser

Semiconductor device and method of making double shielding layers over the semiconductor device

EMI shielding for flip chip package with exposed die backside

Selective EMI shielding using preformed mask

Semiconductor device with partial EMI shielding removal using laser ablation

Mask design for improved attach position

Shielded semiconductor package with open terminal and methods of making

Selective EMI shielding using preformed mask

Selective EMI shielding using preformed mask with fang design

Semiconductor device with partial EMI shielding removal using laser ablation

Mask design for improved attach position

EMI shielding for flip chip package with exposed die backside

Method of forming an embedded magnetic shielding device

Semiconductor device and method of forming EMI shielding material in two-step process to avoid contaminating electrical connector

Semiconductor device and method for partial EMI shielding

Semiconductor device and method for forming electromagnetic interference (EMI) shielded packages with laser-based redistribution and multi-stacked packages

Semiconductor device and method of forming electrical circuit pattern within encapsulant of sip module

Shielded semiconductor package with open terminal and methods of making

PSPI-based patterning method for RDL

Semiconductor device with partial EMI shielding and method of making the same

Selective EMI shielding using preformed mask with fang design

Semiconductor device and method of forming a slot in EMI shielding with improved removal depth

Semiconductor device with partial EMI shielding removal using laser ablation

Semiconductor device and method of forming electrical circuit pattern within encapsulant of SIP module

Semiconductor device and method of forming a slot in EMI shielding with improved removal depth

PSPI-based patterning method for RDL

Shielded semiconductor packages with open terminals and methods of making via two-step process

EMI shielding for flip chip package with exposed die backside

Semiconductor device and method of embedding circuit pattern in encapsulant for SIP module

Semiconductor device and method of forming electrical circuit pattern within encapsulant of SIP module

LG ELECTRONICS INC

Washing drying machine having heat pump and drying operation control method thereof

Laundry machine having induction heater and control method thereof

Clothes treatment apparatus and control method therefor

Washing machine

Method for washing and washing machine

Clothes treatment apparatus and control method therefor

Laundry treatment apparatus and method of controlling the same

Clothes treatment apparatus and control method therefor

KIM WOOYOUNG

Method for washing and washing machine

Washing machine

KIM CHANGOH

Washing method and washing machine

LG CHEMICAL LTD

Anti-reflective film, polarizing plate, and display apparatus