Inventor

JUNG JINHEE

KR36 patents

⚠️ This page may combine multiple inventors who share the name “JUNG JINHEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JUNG JINHEE

STATS CHIPPAC PTE LTD

Laser-based redistribution and multi-stacked packages

Laser-based redistribution and multi-stacked packages

Semiconductor device and method of forming a slot in EMI shielding layer using a plurality of slot lines to guide a laser

Semiconductor device and method of making double shielding layers over the semiconductor device

Selective EMI shielding using preformed mask

Mask design for improved attach position

Selective EMI shielding using preformed mask

Selective EMI shielding using preformed mask with fang design

Mask design for improved attach position

Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant

Semiconductor device and method of forming substrate including embedded component with symmetrical structure

Method of forming an embedded magnetic shielding device

Semiconductor device and method of forming EMI shielding material in two-step process to avoid contaminating electrical connector

Semiconductor device and method for partial EMI shielding

Semiconductor device and method for forming electromagnetic interference (EMI) shielded packages with laser-based redistribution and multi-stacked packages

Semiconductor device and method of forming electrical circuit pattern within encapsulant of sip module

PSPI-based patterning method for RDL

Selective EMI shielding using preformed mask with fang design

Semiconductor device and method of forming a slot in EMI shielding with improved removal depth

Semiconductor device and method of forming electrical circuit pattern within encapsulant of SIP module

Semiconductor device and method of forming a slot in EMI shielding with improved removal depth

PSPI-based patterning method for RDL

Semiconductor device and method of embedding circuit pattern in encapsulant for SIP module

Semiconductor device and method of forming electrical circuit pattern within encapsulant of SIP module

Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant

Semiconductor device and method of forming selective EMI shielding with slotted substrate

Semiconductor device and method of forming multi-layer shielding structure with layers of ferromagnetic material, protective material, laminate material or conductive material over the semiconductor device

Semiconductor device and method of forming substrate including embedded component with symmetrical structure

Semiconductor device and method for reducing metal burrs using laser grooving

LG DISPLAY CO LTD

Display device and driving circuit having improved stability

Data driving circuit and display device

Data driving circuit and display device

Display device

STATS CHIPPAC LTD

Semiconductor device and method of forming substrate including embedded component with symmetrical structure

JEON DONG JU

Integrated circuit packaging system with embedded component and method of manufacture thereof

JUNG JINHEE

Integrated circuit packaging system with coreless substrate and method of manufacture thereof