Inventor
ARANOVICH JULIO
US3 patents
Patents
3 patentsUS5847461ADec 8, 1998
Integrated circuit structure having contact openings and vias filled by self-extrusion of overlying metal layer
APPLIED MATERIALS INC20 citations91
US5668055ASep 16, 1997
Method of filling of contact openings and vias by self-extrusion of overlying compressively stressed matal layer
APPLIED MATERIALS INC30 citations91
US5996353ADec 7, 1999
Semiconductor processing system with a thermoelectric cooling/heating device
APPLIED MATERIALS INC55 citations88