Inventor
LIEBHARD MARKUS K
US7 patents
⚠️ This page may combine multiple inventors who share the name “LIEBHARD MARKUS K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
6 patentsUS6589801B1Jul 8, 2003
Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques
AMKOR TECHNOLOGY INC55 citations94
US6528857B1Mar 4, 2003
Chip size image sensor bumped package
AMKOR TECHNOLOGY INC34 citations92
US6509560B1Jan 21, 2003
Chip size image sensor in wirebond package with step-up ring for electrical contact
AMKOR TECHNOLOGY INC34 citations92
US6486537B1Nov 26, 2002
Semiconductor package with warpage resistant substrate
AMKOR TECHNOLOGY INC30 citations91
US6629633B1Oct 7, 2003
Chip size image sensor bumped package fabrication method
AMKOR TECHNOLOGY INC13 citations84
US6620646B1Sep 16, 2003
Chip size image sensor wirebond package fabrication method
AMKOR TECHNOLOGY INC7 citations73